V380SDC
vs
KU8230920
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
V3 SEMICONDUCTOR
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
PLASTIC, QFP-100
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-PQFP-G100
|
S-PQFP-G100
|
| Number of Terminals |
100
|
100
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
BQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, BUMPER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CHMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
No
|
| Address Bus Width |
|
11
|
| Boundary Scan |
|
NO
|
| External Data Bus Width |
|
8
|
| JESD-609 Code |
|
e0
|
| Length |
|
19.05 mm
|
| Low Power Mode |
|
NO
|
| Number of Banks |
|
4
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
SPQFP100,.9SQ
|
| Seated Height-Max |
|
4.572 mm
|
| Supply Current-Max |
|
180 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
0.635 mm
|
| Width |
|
19.05 mm
|
|
|
|
Compare V380SDC with alternatives
Compare KU8230920 with alternatives