VNC2-64Q1B
vs
UPD350DT-I/Q8XVAA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC64,.32SQ,16
|
QFN-28
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
FTDI Chip
|
|
| Additional Feature |
ALSO REQUIRES AT 3.3 V I/O SUPPLY
|
|
| Address Bus Width |
|
|
| Clock Frequency-Max |
6 MHz
|
|
| Data Transfer Rate-Max |
1.5 MBps
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N64
|
S-PQCC-N28
|
| Length |
8 mm
|
4 mm
|
| Number of Terminals |
64
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HQCCN
|
| Package Equivalence Code |
LCC64,.32SQ,16
|
LCC28,.16SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.98 V
|
1.98 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
| Bus Compatibility |
|
SPI
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max |
|
15 mA
|
|
|
|
Compare VNC2-64Q1B with alternatives
Compare UPD350DT-I/Q8XVAA with alternatives