VSC8489YJU-01 vs BCM53106SIFBG feature comparison

VSC8489YJU-01 Microchip Technology Inc

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BCM53106SIFBG Broadcom Limited

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Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC BROADCOM INC
Package Description FCBGA-196 TFBGA,
Reach Compliance Code compliant compliant
ECCN Code 5A991.B
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B196 S-PBGA-B212
Length 15 mm 11 mm
Number of Functions 1 1
Number of Terminals 196 212
Operating Temperature-Max 110 °C 85 °C
Operating Temperature-Min -40 °C -45 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max 1.4 mm 1.017 mm
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 11 mm
Base Number Matches 1 1
Rohs Code Yes
Moisture Sensitivity Level 3
Technology CMOS

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Compare BCM53106SIFBG with alternatives