VSC8489YJU-01
vs
BCM53106SIFBG
feature comparison
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BROADCOM INC
|
Package Description |
FCBGA-196
|
TFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.B
|
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B212
|
Length |
15 mm
|
11 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
196
|
212
|
Operating Temperature-Max |
110 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-45 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
TFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Seated Height-Max |
1.4 mm
|
1.017 mm
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
15 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Moisture Sensitivity Level |
|
3
|
Technology |
|
CMOS
|
|
|
|
Compare VSC8489YJU-01 with alternatives
Compare BCM53106SIFBG with alternatives