VSC8504XKS-05
vs
VSC8514XMK-14
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.B.1
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
Microsemi Corporation
|
Data Rate |
1000000 Mbps
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBCC-B138
|
Length |
17 mm
|
12 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
138
|
Number of Transceivers |
4
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HVBCC
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1.8 mm
|
0.85 mm
|
Supply Current-Max |
900 mA
|
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
BUTT
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
12 mm
|
Base Number Matches |
1
|
2
|
Package Description |
|
QFN-138
|
Date Of Intro |
|
2018-08-21
|
|
|
|
Compare VSC8504XKS-05 with alternatives
Compare VSC8514XMK-14 with alternatives