VSC8514XMK
vs
VSC7421XJQ-02
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-138
|
HTFQFP, TQFP302,1SQ
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microsemi Corporation
|
Microchip
|
| JESD-30 Code |
S-PBCC-B138
|
S-PQFP-G302
|
| Length |
12 mm
|
24 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
138
|
302
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVBCC
|
HTFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
0.85 mm
|
1.2 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Terminal Form |
BUTT
|
GULL WING
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
12 mm
|
24 mm
|
| Base Number Matches |
2
|
2
|
| Date Of Intro |
|
2019-10-10
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
TQFP302,1SQ
|
| Supply Current-Max |
|
2.6 mA
|
| Temperature Grade |
|
OTHER
|
| Terminal Pitch |
|
0.5 mm
|
|
|
|
Compare VSC8514XMK with alternatives
Compare VSC7421XJQ-02 with alternatives