W24257-70L vs 5962-9318712HXA feature comparison

W24257-70L Winbond Electronics Corp

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5962-9318712HXA Cobham Semiconductor Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP AEROFLEX COLORADO SPRINGS
Part Package Code DIP PGA
Package Description 0.600 INCH, PLASTIC, DIP-28 HIP,
Pin Count 28 66
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 55 ns
JESD-30 Code R-PDIP-T28 S-XHIP-P66
JESD-609 Code e3 e0
Length 37.08 mm 30.1 mm
Memory Density 262144 bit 4194304 bit
Memory IC Type STANDARD SRAM CACHE SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 66
Number of Words 32768 words 131072 words
Number of Words Code 32000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 128KX32
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP HIP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 6.22 mm
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL HEX
Width 15.24 mm 30.1 mm
Base Number Matches 1 3
Screening Level MIL-PRF-38535

Compare W24257-70L with alternatives

Compare 5962-9318712HXA with alternatives