W24257-70L
vs
5962-9322503MYX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
PYRAMID SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
0.600 INCH, PLASTIC, DIP-28
|
QCCN,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
70 ns
|
25 ns
|
| JESD-30 Code |
R-PDIP-T28
|
R-CQCC-N28
|
| JESD-609 Code |
e3
|
|
| Length |
37.08 mm
|
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 words
|
65536 words
|
| Number of Words Code |
32000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
32KX8
|
64KX4
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.33 mm
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
2
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare W24257-70L with alternatives
Compare 5962-9322503MYX with alternatives