W26A02B-70LE vs IS62US25616LL-70B feature comparison

W26A02B-70LE Winbond Electronics Corp

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IS62US25616LL-70B Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description TFBGA, BGA48,6X8,30 MINI, BGA-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e0
Length 8 mm
Memory Density 2097152 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Organization 128KX16 256KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 1.95 V 2.2 V
Supply Voltage-Min (Vsup) 1.65 V 1.8 V
Supply Voltage-Nom (Vsup) 1.8 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Moisture Sensitivity Level 3

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Compare IS62US25616LL-70B with alternatives