W26A041B70LE vs V62C2184096L-55B feature comparison

W26A041B70LE Winbond Electronics Corp

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V62C2184096L-55B Mosel Vitelic Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MOSEL-VITELIC
Part Package Code BGA BGA
Package Description TFBGA, BGA48,6X8,30 TFBGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 8 mm 10 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 524288 words
Number of Words Code 256000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Organization 256KX16 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Standby Voltage-Min 1.5 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 1.95 V 2.8 V
Supply Voltage-Min (Vsup) 1.65 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 8 mm
Base Number Matches 1 2

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Compare V62C2184096L-55B with alternatives