W26A04B-70LE vs HY62QF16201ASLM-70I feature comparison

W26A04B-70LE Winbond Electronics Corp

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HY62QF16201ASLM-70I SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP SK HYNIX INC
Part Package Code BGA BGA
Package Description TFBGA, BGA48,6X8,30 FBGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e1
Length 8 mm
Memory Density 4194304 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Organization 256KX16 128KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 1.95 V 2.8 V
Supply Voltage-Min (Vsup) 1.65 V 2.2 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm
Base Number Matches 1 1

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Compare HY62QF16201ASLM-70I with alternatives