W26B021T10LE
vs
UPD442012AGY-BC70X-MJH
feature comparison
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
|
| Part Package Code |
TSOP1
|
|
| Package Description |
TSOP1, TSSOP48,.71,20
|
|
| Pin Count |
48
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
3A991.B.2.A
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
100 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDSO-G48
|
|
| JESD-609 Code |
e3
|
|
| Length |
16.4 mm
|
|
| Memory Density |
2097152 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
48
|
|
| Number of Words |
131072 words
|
|
| Number of Words Code |
128000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Organization |
128KX16
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSOP1
|
|
| Package Equivalence Code |
TSSOP48,.71,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Standby Voltage-Min |
1.5 V
|
|
| Supply Current-Max |
0.02 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
12 mm
|
|
| Base Number Matches |
1
|
|
|
|
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