W78C32B-24 vs LP87C58-33 feature comparison

W78C32B-24 Winbond Electronics Corp

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LP87C58-33 Intel Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEL CORP
Part Package Code DIP DIP
Package Description DIP, DIP40,.6 DIP,
Pin Count 40 40
Reach Compliance Code not_compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051
Clock Frequency-Max 24 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e0
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256
Speed 24 MHz 33 MHz
Supply Current-Max 30 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
ECCN Code 3A991.A.2
Additional Feature BOOLEAN PROCESSOR
Length 52.26 mm
ROM Programmability OTPROM
Seated Height-Max 5.08 mm
Width 15.24 mm

Compare W78C32B-24 with alternatives

Compare LP87C58-33 with alternatives