WL1831MODGBMOCT
vs
XWL1831MODGAMOCT
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
MOC-100
|
LGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Data Rate |
100000 Mbps
|
|
JESD-30 Code |
R-PBGA-B100
|
R-PBGA-N100
|
JESD-609 Code |
e4
|
|
Length |
13.4 mm
|
13.4 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LGA
|
LGA
|
Package Equivalence Code |
LGA100(UNSPEC)
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2 mm
|
2 mm
|
Supply Voltage-Nom |
3.7 V
|
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
BUTT
|
NO LEAD
|
Terminal Pitch |
0.7 mm
|
0.7 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
13.3 mm
|
13.3 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare WL1831MODGBMOCT with alternatives
Compare XWL1831MODGAMOCT with alternatives