WS27C128F-12DMB vs D27128 feature comparison

WS27C128F-12DMB Waferscale Integration Inc

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D27128 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC INTEL CORP
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 120 ns 250 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T28 R-XDIP-T28
JESD-609 Code e0 e0
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM CARD UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V 21 V
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0002 A
Supply Current-Max 0.06 mA 0.14 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Package Description DIP-28

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