WS57C128FB-70D vs 5962-8766108XX feature comparison

WS57C128FB-70D Waferscale Integration Inc

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5962-8766108XX AMD

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC ADVANCED MICRO DEVICES INC
Package Description CERDIP-28 ,
Reach Compliance Code unknown unknown
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0005 A
Supply Current-Max 0.05 mA 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61

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