WS5901CYM
vs
IDT39C01DP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WAFERSCALE INTEGRATION INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Clock Frequency-Max |
31.25 MHz
|
43 MHz
|
| External Data Bus Width |
4
|
4
|
| JESD-30 Code |
R-GDIP-T40
|
R-PDIP-T40
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
DIP40,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
BIT-SLICE MICROPROCESSOR
|
BIT-SLICE MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Package Description |
|
0.600 INCH, PLASTIC, DIP-40
|
| Pin Count |
|
40
|
| Length |
|
52.07 mm
|
| Seated Height-Max |
|
4.699 mm
|
| Supply Current-Max |
|
35 mA
|
| Width |
|
15.24 mm
|
|
|
|
Compare WS5901CYM with alternatives
Compare IDT39C01DP with alternatives