XA6SLX4-3CSG225Q
vs
XA6SLX4-3CSG225I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Clock Frequency-Max |
62.5 MHz
|
62.5 MHz
|
JESD-30 Code |
S-PBGA-B225
|
S-PBGA-B225
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
132
|
132
|
Number of Logic Cells |
3840
|
3840
|
Number of Outputs |
132
|
132
|
Number of Terminals |
225
|
225
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA225,15X15,32
|
BGA225,15X15,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
|
|
|
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