XA6SLX4-3CSG225Q vs XC6SLX4-2CSG225I feature comparison

XA6SLX4-3CSG225Q AMD Xilinx

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XC6SLX4-2CSG225I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 62.5 MHz 667 MHz
JESD-30 Code S-PBGA-B225 S-PBGA-B225
JESD-609 Code e1 e1
Moisture Sensitivity Level 3 3
Number of Inputs 132 120
Number of Logic Cells 3840 3840
Number of Outputs 132 120
Number of Terminals 225 225
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA LFBGA
Package Equivalence Code BGA225,15X15,32 BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Package Description 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
Pin Count 225
Combinatorial Delay of a CLB-Max 0.26 ns
Length 13 mm
Number of CLBs 300
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 300 CLBS
Seated Height-Max 1.4 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Technology CMOS
Temperature Grade INDUSTRIAL
Width 13 mm

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Compare XC6SLX4-2CSG225I with alternatives