XC17S10PDG8I vs XC17S10XLVOG8I feature comparison

XC17S10PDG8I AMD Xilinx

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XC17S10XLVOG8I AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP TSOP
Package Description DIP, TSOP2, DIP8,.3
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.3599 mm 4.9 mm
Memory Density 95008 bit 95752 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 95008 words 95752 words
Number of Words Code 95008 95752
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 95008X1 95752X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 250 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA

Compare XC17S10PDG8I with alternatives

Compare XC17S10XLVOG8I with alternatives