XC17S10VOG8C vs XC17S10PD8I feature comparison

XC17S10VOG8C AMD Xilinx

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XC17S10PD8I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code TSOP DIP
Package Description TSOP2, DIP8,.3 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Clock Frequency-Max (fCLK) 10 MHz 10 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G8 R-PDIP-T8
JESD-609 Code e3 e0
Length 4.9 mm 9.3599 mm
Memory Density 95008 bit 95008 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 95008 words 95008 words
Number of Words Code 95008 95008
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 95008X1 95008X1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 4.5974 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 1

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