XC17S10XLPDG8C vs XC17S10VOG8C feature comparison

XC17S10XLPDG8C AMD Xilinx

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XC17S10VOG8C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP TSOP
Package Description ROHS COMPLIANT, PLASTIC, DIP-8 TSOP2, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Clock Frequency-Max (fCLK) 10 MHz 10 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.3599 mm 4.9 mm
Memory Density 95752 bit 95008 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 95752 words 95008 words
Number of Words Code 95752 95008
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 95752X1 95008X1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP2
Package Equivalence Code TSOP8,.25 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 250 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 1.2 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.005 mA 0.01 mA
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.62 mm 3.9 mm
Base Number Matches 1 1

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