XC17S20PD8C vs XC17S150XLPD8C feature comparison

XC17S20PD8C Rochester Electronics LLC

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XC17S150XLPD8C AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.3599 mm 9.3599 mm
Memory Density 178144 bit 1040128 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 178144 words 1040128 words
Number of Words Code 178144 1040128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 178144X1 1040128X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 225 225
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.5974 mm 4.5974 mm
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
ECCN Code EAR99
HTS Code 8542.32.00.71
Factory Lead Time 4 Weeks
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA

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