XC17S20PD8I vs XC17S20PDG8C feature comparison

XC17S20PD8I Rochester Electronics LLC

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XC17S20PDG8C AMD Xilinx

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code unknown compliant
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.3599 mm 9.3599 mm
Memory Density 178144 bit 178144 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 178144 words 178144 words
Number of Words Code 178144 178144
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 178144X1 178144X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.5974 mm 4.5974 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.32.00.71
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

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