XC3S1000-4FG456C vs XC3S700A-4FG484C feature comparison

XC3S1000-4FG456C AMD Xilinx

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XC3S700A-4FG484C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, FBGA-456 FBGA-484
Pin Count 456 484
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 35 Weeks 35 Weeks
Clock Frequency-Max 630 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.71 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B484
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1920 1472
Number of Equivalent Gates 1000000 700000
Number of Inputs 333 372
Number of Logic Cells 17280 13248
Number of Outputs 333 288
Number of Terminals 456 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1920 CLBS, 1000000 GATES 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S1000-4FG456C with alternatives

Compare XC3S700A-4FG484C with alternatives