There are no models available for this part yet.
Overview of XC3S700A-4FG484C by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 7 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
CAD Models for XC3S700A-4FG484C by AMD Xilinx
Part Data Attributes for XC3S700A-4FG484C by AMD Xilinx
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
XILINX INC
|
Part Package Code
|
BGA
|
Package Description
|
FBGA-484
|
Pin Count
|
484
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
3A991.D
|
HTS Code
|
8542.39.00.01
|
Factory Lead Time
|
35 Weeks
|
Clock Frequency-Max
|
667 MHz
|
Combinatorial Delay of a CLB-Max
|
0.71 ns
|
JESD-30 Code
|
S-PBGA-B484
|
JESD-609 Code
|
e0
|
Length
|
23 mm
|
Moisture Sensitivity Level
|
3
|
Number of CLBs
|
1472
|
Number of Equivalent Gates
|
700000
|
Number of Inputs
|
372
|
Number of Logic Cells
|
13248
|
Number of Outputs
|
288
|
Number of Terminals
|
484
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
1472 CLBS, 700000 GATES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA484,22X22,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
225
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.6 mm
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
1.14 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
23 mm
|
Alternate Parts for XC3S700A-4FG484C
This table gives cross-reference parts and alternative options found for XC3S700A-4FG484C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S700A-4FG484C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XC3S700AN-4FGG484I | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, ROHS COMPLIANT, FBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700AN-4FGG484I |
XC3S700A-4FGG484C | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 250MHz, 13248-Cell, CMOS, PBGA484, LEAD FREE, FPBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700A-4FGG484C |
XC3S700A-4FGG484I | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 250MHz, 13248-Cell, CMOS, PBGA484, LEAD FREE, FPBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700A-4FGG484I |
XC3S700AN-4FG484I | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, FBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700AN-4FG484I |
XC3S700AN-4FGG484C | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, ROHS COMPLIANT, FBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700AN-4FGG484C |
XC3S700AN-4FG484C | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, FBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700AN-4FG484C |
XC3S700A-4FG484I | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 250MHz, 13248-Cell, CMOS, PBGA484, FPBGA-484 | AMD Xilinx | XC3S700A-4FG484C vs XC3S700A-4FG484I |
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