XC3S2000-4FGG676I vs XC3S4000-4FG676C feature comparison

XC3S2000-4FGG676I AMD

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XC3S4000-4FG676C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description 27 X 27 MM, LEAD FREE, FBGA-676 27 X 27 MM, FBGA-676
Reach Compliance Code compliant not_compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5120 6912
Number of Equivalent Gates 2000000 4000000
Number of Inputs 489 489
Number of Logic Cells 46080 62208
Number of Outputs 489 489
Number of Terminals 676 676
Organization 5120 CLBS, 2000000 GATES 6912 CLBS, 4000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 676
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 30 Weeks
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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