XC3S700A-4FG400I
vs
XC3S700AN-5FGG400C
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FBGA-400
|
ROHS COMPLIANT, FBGA-400
|
Pin Count |
400
|
400
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.D
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
35 Weeks
|
|
Clock Frequency-Max |
667 MHz
|
770 MHz
|
Combinatorial Delay of a CLB-Max |
0.71 ns
|
4.36 ns
|
JESD-30 Code |
S-PBGA-B400
|
S-PBGA-B400
|
JESD-609 Code |
e0
|
e1
|
Length |
21 mm
|
21 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
1472
|
1472
|
Number of Equivalent Gates |
700000
|
700000
|
Number of Inputs |
311
|
|
Number of Logic Cells |
13248
|
|
Number of Outputs |
248
|
|
Number of Terminals |
400
|
400
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1472 CLBS, 700000 GATES
|
1472 CLBS, 700000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA400,20X20,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.43 mm
|
2.43 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
21 mm
|
21 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XC3S700A-4FG400I with alternatives
Compare XC3S700AN-5FGG400C with alternatives