XC3S700AN-5FGG400C vs XC3S700A-4FGG400C feature comparison

XC3S700AN-5FGG400C AMD Xilinx

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XC3S700A-4FGG400C AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description ROHS COMPLIANT, FBGA-400 FBGA-400
Pin Count 400 400
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 770 MHz 667 MHz
Combinatorial Delay of a CLB-Max 4.36 ns 0.71 ns
JESD-30 Code S-PBGA-B400 S-PBGA-B400
JESD-609 Code e1 e1
Length 21 mm 21 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1472 1472
Number of Equivalent Gates 700000 700000
Number of Terminals 400 400
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1472 CLBS, 700000 GATES 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.43 mm 2.43 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 21 mm 21 mm
Base Number Matches 1 1
Pbfree Code Yes
ECCN Code 3A991.D
Factory Lead Time 35 Weeks
Number of Inputs 311
Number of Logic Cells 13248
Number of Outputs 248
Package Equivalence Code BGA400,20X20,40
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3S700AN-5FGG400C with alternatives

Compare XC3S700A-4FGG400C with alternatives