XC4VLX15-11SF363CS2 vs XC4VLX15-11FFG676CS2 feature comparison

XC4VLX15-11SF363CS2 AMD Xilinx

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XC4VLX15-11FFG676CS2 AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1205 MHz
JESD-30 Code S-PBGA-B363
JESD-609 Code e0
Moisture Sensitivity Level 4 4
Number of Inputs 240
Number of Logic Cells 13824
Number of Outputs 240
Number of Terminals 363
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA363,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Surface Mount YES
Technology CMOS
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1

Compare XC4VLX15-11SF363CS2 with alternatives

Compare XC4VLX15-11FFG676CS2 with alternatives