XC6SLX9-3FTG256I
vs
XC6SLX9-3FTG256Q
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
|
| Package Description |
17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
862 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.21 ns
|
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e1
|
e1
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
715
|
|
| Number of Inputs |
186
|
|
| Number of Logic Cells |
9152
|
|
| Number of Outputs |
186
|
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
715 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.55 mm
|
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
17 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC6SLX9-3FTG256I with alternatives
Compare XC6SLX9-3FTG256Q with alternatives