XC6VLX130T-2FFG784C vs XC6VLX130T-L1FFG784I feature comparison

XC6VLX130T-2FFG784C AMD Xilinx

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XC6VLX130T-L1FFG784I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 29 X 29 MM, LEAD FREE, FBGA-784 29 X 29 MM, LEAD FREE, FBGA-784
Pin Count 784 784
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 1286 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 4.29 ns 5.87 ns
JESD-30 Code S-PBGA-B784 S-PBGA-B784
JESD-609 Code e1 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 4 4
Number of Inputs 400 400
Number of Logic Cells 128000 128000
Number of Outputs 400 400
Number of Terminals 784 784
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA784,28X28,40 BGA784,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.1 mm 3.1 mm
Supply Voltage-Max 1.05 V 0.93 V
Supply Voltage-Min 0.95 V 0.87 V
Supply Voltage-Nom 1 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29 mm 29 mm
Base Number Matches 1 1

Compare XC6VLX130T-2FFG784C with alternatives

Compare XC6VLX130T-L1FFG784I with alternatives