XC7Z100-L2FFG1156I
vs
XC7Z100-L2FFG900I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
BGA,
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
65 Weeks
|
65 Weeks
|
| JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B900
|
| Length |
35 mm
|
27 mm
|
| Number of Terminals |
1156
|
900
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1156,34X34,40
|
BGA900,30X30,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Seated Height-Max |
3.1 mm
|
3.24 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
|
|
|