XCKU040-1FBVA900C vs XCKU040-1FBVA900I feature comparison

XCKU040-1FBVA900C AMD Xilinx

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XCKU040-1FBVA900I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1920 1920
Number of Inputs 520 520
Number of Logic Cells 530250 530250
Number of Outputs 520 520
Number of Terminals 900 900
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS 1920 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Supply Voltage-Max 0.979 V 0.979 V
Supply Voltage-Min 0.922 V 0.922 V
Supply Voltage-Nom 0.95 V 0.95 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 2 2

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