XCKU5P-1LFFVD900I
vs
XCKU5P-L1SFVB784I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
4
|
4
|
| Peak Reflow Temperature (Cel) |
245
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
3A991.D
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
52 Weeks
|
| Date Of Intro |
|
2016-06-03
|
| Additional Feature |
|
IT ALSO OPERATES AT 0.85 V
|
| JESD-30 Code |
|
S-PBGA-B784
|
| Length |
|
23 mm
|
| Number of CLBs |
|
27120
|
| Number of Inputs |
|
304
|
| Number of Logic Cells |
|
474600
|
| Number of Outputs |
|
304
|
| Number of Terminals |
|
784
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
27120 CLBS
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
FBGA
|
| Package Equivalence Code |
|
BGA784,28X28,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, FINE PITCH
|
| Seated Height-Max |
|
3.32 mm
|
| Supply Voltage-Max |
|
0.742 V
|
| Supply Voltage-Min |
|
0.698 V
|
| Supply Voltage-Nom |
|
0.72 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
23 mm
|
|
|
|
Compare XCKU5P-L1SFVB784I with alternatives