XCKU5P-L1SFVB784I
vs
XQKU5P-L1FFRB676I
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
52 Weeks
|
|
| Date Of Intro |
2016-06-03
|
|
| Additional Feature |
IT ALSO OPERATES AT 0.85 V
|
|
| JESD-30 Code |
S-PBGA-B784
|
S-PBGA-B676
|
| JESD-609 Code |
e1
|
e0
|
| Length |
23 mm
|
27 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
27120
|
27120
|
| Number of Inputs |
304
|
304
|
| Number of Logic Cells |
474600
|
474600
|
| Number of Outputs |
304
|
304
|
| Number of Terminals |
784
|
676
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
27120 CLBS
|
27120 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
BGA
|
| Package Equivalence Code |
BGA784,28X28,32
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
3.32 mm
|
3.67 mm
|
| Supply Voltage-Max |
0.742 V
|
0.742 V
|
| Supply Voltage-Min |
0.698 V
|
0.698 V
|
| Supply Voltage-Nom |
0.72 V
|
0.72 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
23 mm
|
27 mm
|
| Base Number Matches |
2
|
2
|
| Screening Level |
|
MIL-PRF-38535
|
|
|
|
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