XIO2000AIZHC vs XIO2000AIZHH feature comparison

XIO2000AIZHC Texas Instruments

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XIO2000AIZHH Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description BGA, BGA175(UNSPEC) BGA-175
Pin Count 175 175
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 3.3V SUPPLY ALSO OPERATES AT 3.3V SUPPLY
Address Bus Width 32 32
Clock Frequency-Max 125 MHz 125 MHz
Data Transfer Rate-Max 250 MBps 250 MBps
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B175 S-PBGA-B175
Number of Terminals 175 175
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Equivalence Code BGA175(UNSPEC) BGA175,14X14,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.35 V 1.35 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e1
Length 12 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.4 mm
Terminal Finish TIN SILVER COPPER
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm

Compare XIO2000AIZHC with alternatives

Compare XIO2000AIZHH with alternatives