XOMAP3525BCUS vs XDM3730ACUS feature comparison

XOMAP3525BCUS Texas Instruments

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XDM3730ACUS Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description VFBGA, BGA423,24X24,25 LFBGA,
Pin Count 423 423
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 15
Boundary Scan YES YES
Clock Frequency-Max 19.2 MHz 38.4 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B423 S-PBGA-B423
Length 14 mm 16 mm
Low Power Mode YES YES
Number of Terminals 423 423
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA LFBGA
Package Equivalence Code BGA423,24X24,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.4 mm
Speed 600 MHz 800 MHz
Supply Voltage-Max 1.89 V 1.33 V
Supply Voltage-Min 1.71 V 1.21 V
Supply Voltage-Nom 1.8 V 1.27 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
ECCN Code 3A991.A.2

Compare XOMAP3525BCUS with alternatives

Compare XDM3730ACUS with alternatives