XPC7451RX733PG
vs
AM3505AZERAC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
BGA,
|
BGA, BGA484,22X22,40
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
32
|
16
|
JESD-30 Code |
S-CBGA-B484
|
S-PBGA-B484
|
Number of Terminals |
484
|
484
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
733 MHz
|
600 MHz
|
Supply Voltage-Max |
1.85 V
|
1.248 V
|
Supply Voltage-Min |
1.75 V
|
1.152 V
|
Supply Voltage-Nom |
1.8 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
484
|
ECCN Code |
|
3A991.A.2
|
Address Bus Width |
|
16
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
26 MHz
|
External Data Bus Width |
|
16
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-609 Code |
|
e1
|
Length |
|
23 mm
|
Low Power Mode |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA484,22X22,40
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
2.48 mm
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Pitch |
|
1 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
23 mm
|
|
|
|
Compare XPC7451RX733PG with alternatives
Compare AM3505AZERAC with alternatives