XPC8245LZU300B vs MPC8245LZU300D feature comparison

XPC8245LZU300B Freescale Semiconductor

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MPC8245LZU300D NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description LBGA, BGA352,26X26,50 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
Pin Count 352
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
Length 35 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 352 352
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 300 MHz 300 MHz
Supply Voltage-Max 1.9 V 2.1 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Factory Lead Time 2 Days
Operating Temperature-Max 105 °C
Operating Temperature-Min
Temperature Grade OTHER

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