XPC8260ZUIFBC vs MPC8260CZUIHBXXX feature comparison

XPC8260ZUIFBC Freescale Semiconductor

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MPC8260CZUIHBXXX Freescale Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 LBGA,
Pin Count 480 480
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.7 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B480 S-PBGA-B480
JESD-609 Code e0
Length 37.5 mm 37.5 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3
Number of Terminals 480 480
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA480,29X29,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 200 MHz 200 MHz
Supply Voltage-Max 1.9 V 2.7 V
Supply Voltage-Min 1.7 V 2.4 V
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature ALSO REQUIRES 3.3V SUPPLY

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