XPC850DEVR66BU vs 79RC32H434266BCI feature comparison

XPC850DEVR66BU Freescale Semiconductor

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79RC32H434266BCI Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code 5A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 125 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 23 mm 17 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 1.7 mm
Speed 66 MHz 266 MHz
Supply Voltage-Max 3.465 V 1.3 V
Supply Voltage-Min 3.135 V 1.1 V
Supply Voltage-Nom 3.3 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 20
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA256,16X16,40
Temperature Grade INDUSTRIAL

Compare XPC850DEVR66BU with alternatives

Compare 79RC32H434266BCI with alternatives