XPC860DEZP50D4
vs
TSPC860MHVZPU50B
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
THOMSON-CSF SEMICONDUCTORS
|
| Package Description |
BGA, BGA357,19X19,50
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B357
|
S-PBGA-B357
|
| Length |
25 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
357
|
357
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA357,19X19,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
|
| Speed |
50 MHz
|
50 MHz
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
25 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
357
|
| Operating Temperature-Max |
|
110 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare TSPC860MHVZPU50B with alternatives