XR16L788IQ-F
vs
SCC2698BE1A84
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
MAXLINEAR INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
QFP, QFP100,.7X.9
|
QCCJ, LDCC84,1.2SQ
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A991
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
MaxLinear, Inc.
|
|
| Address Bus Width |
8
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
50 MHz
|
|
| Communication Protocol |
ASYNC, BIT
|
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.78125 MBps
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
R-PQFP-G100
|
S-PQCC-J84
|
| JESD-609 Code |
e3
|
e0
|
| Length |
20 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Serial I/Os |
8
|
|
| Number of Terminals |
100
|
84
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Equivalence Code |
QFP100,.7X.9
|
LDCC84,1.2SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
|
| Supply Current-Max |
5 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
2
|
|
|
|
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