XWL1801MODGAMOCT
vs
WL1831MODGBMOCR
feature comparison
Pbfree Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
LGA,
|
MOC-100
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
JESD-30 Code |
R-PBGA-N100
|
R-PBGA-B100
|
Length |
13.4 mm
|
13.4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LGA
|
LGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Seated Height-Max |
2 mm
|
2 mm
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
BUTT
|
Terminal Pitch |
0.7 mm
|
0.7 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13.3 mm
|
13.3 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
ECCN Code |
|
5A992.C
|
Samacsys Manufacturer |
|
Texas Instruments
|
Data Rate |
|
100000 Mbps
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
LGA100(UNSPEC)
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Voltage-Nom |
|
3.7 V
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XWL1801MODGAMOCT with alternatives
Compare WL1831MODGBMOCR with alternatives