ZGP323LSP2832G
vs
ZGP323LSP2832G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZILOG INC
|
IXYS CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP28,.6
|
LEAD FREE, PLASTIC, DIP-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
Z8
|
Z8
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T28
|
R-PDIP-T28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
36.96 mm
|
36.96 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
24
|
24
|
| Number of Terminals |
28
|
28
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
255
|
255
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
237
|
237
|
| ROM (words) |
32768
|
32768
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
5.21 mm
|
5.21 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|