ZL30407QCC
vs
MAX24310EXG+
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
QFP
|
BGA
|
| Pin Count |
80
|
81
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G80
|
S-PBGA-B81
|
| Number of Terminals |
80
|
81
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LBGA
|
| Package Equivalence Code |
QFP80,.64SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Supply Current-Max |
0.155 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.635 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
| Length |
|
10 mm
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.47 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
10 mm
|
|
|
|
Compare ZL30407QCC with alternatives
Compare MAX24310EXG+ with alternatives