ZL50019GAG2
vs
ZL50031QEG1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256
|
28 X 28 MM, 3.37 MM HEIGHT, LEAD FREE, MS-029, MQFP-256
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
8 Weeks
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G256
|
JESD-609 Code |
e1
|
e3
|
Length |
17 mm
|
28 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HFQFP
|
Package Equivalence Code |
BGA256,16X16,40
|
QFP256,1.2SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
3.7 mm
|
Supply Current-Max |
165 mA
|
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
DIGITAL TIME SWITCH
|
DIGITAL TIME SWITCH
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
17 mm
|
28 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
QFP
|
Pin Count |
|
256
|
HTS Code |
|
8542.39.00.01
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare ZL50019GAG2 with alternatives
Compare ZL50031QEG1 with alternatives