ZL50112GAG2
vs
ZL50112GAG2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
35 X 35 MM, 1.27 MM, LEAD FREE, PLASTIC, BGA-552
|
,
|
| Pin Count |
552
|
552
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B552
|
S-PBGA-B552
|
| JESD-609 Code |
e1
|
e2
|
| Length |
35 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
552
|
552
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA552,26X26,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.53 mm
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER OVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ZL50112GAG2 with alternatives
Compare ZL50112GAG2 with alternatives