ZL792388GDG2
vs
LE792388TVC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA-196
|
LQFP-176
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
IT ALSO REQUIRES 3.3V SUPPLY
|
IT ALSO REQUIRES 3.3V SUPPLY
|
| Analog Input-Max |
3.465 V
|
3.465 V
|
| Companding Law |
A/MU-LAW
|
A/MU-LAW
|
| Filter |
YES
|
YES
|
| Input Code |
TWOS COMPLEMENT
|
TWOS COMPLEMENT
|
| JESD-30 Code |
S-PBGA-B196
|
S-PQFP-G176
|
| Length |
15 mm
|
20 mm
|
| Linear Coding |
16-BIT
|
16-BIT
|
| Number of Channels |
8
|
8
|
| Number of Functions |
8
|
8
|
| Number of Terminals |
196
|
176
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
VOLTAGE
|
VOLTAGE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LFQFP
|
| Package Equivalence Code |
BGA196,14X14,40
|
QFP176,.87SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
1.65 mm
|
1.6 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
15 mm
|
20 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
7 Weeks
|
|
|
|
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