There are no models available for this part yet.
Overview of 323-50120 by HellermannTyton
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Not Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
54122-808501200LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch | |
54242-407501200LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch. | |
84501-201 | Amphenol Communications Solutions | 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array |
Price & Stock for 323-50120 by HellermannTyton
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
TREDUX-MA47-12-BK
|
TME | Heat shrink sleeve, 12mm, black Min Qty: 6 | 0 |
|
$11.2300 / $13.9500 | RFQ |